Field Service Engineer is responsible for equipment installation,\u00a0maintenance, modification of equipment in the field, sales of\u00a0<\/p>\n
maintenance parts and troubleshooting\u00a0<\/p>\n
The secondary responsibility is developing, optimizing, yield\u00a0improvement, process integration, and customer technical support,\u00a0and sustaining fan-out wafer level packaging (FOWLP) processes.<\/p>\n
\u00a0<\/p>\n
\uf09f Role Weighting\u00a0<\/p>\n
\uf0b7 Process Engineering: Approximately 10-20%<\/p>\n
\uf0b7 Field Service Engineering: Approximately 80-90%<\/p>\n
<\/p>\n
Key Responsibilities\u00a0<\/p>\n
\uf09f Field Service Engineering (Primary Responsibility)\u00a0<\/p>\n
\uf09f Equipment Installation & Maintenance\u00a0<\/p>\n
\uf0b7 Support installation, setup, and qualification of backend equipment\u00a0<\/p>\n
\uf0b7 Perform and support FAT\/SAT and customer acceptance testing\u00a0<\/p>\n
\uf0b7 Execute preventive and corrective maintenance as needed\u00a0<\/p>\n
\uf0b7 Discussion about specification of modification of equipment in the\u00a0field.\u00a0<\/p>\n
\uf0b7 Sales activities of maintenance parts\u00a0<\/p>\n
\uf09f Equipment Troubleshooting & Escalation Support\u00a0<\/p>\n
\uf0b7 Troubleshoot mechanical, electrical, pneumatic, vacuum, and\u00a0software issues of equipment, wafer handling robots, aligners,\u00a0EFEM and new products that TAZMO Japan develops and market in\u00a0the future.\u00a0<\/p>\n
\uf0b7 Diagnose process-induced tool issues and coordinate resolution\u00a0<\/p>\n
\uf0b7 Support tool calibration, recipe setup, and tool matching\u00a0<\/p>\n
\uf09f Documentation & Feedback\u00a0<\/p>\n
\uf0b7 Prepare service reports, RCA documentation, and customer\u00a0communications\u00a0<\/p>\n
\uf0b7 Provide structured feedback to engineering teams for tool and\u00a0process improvement\u00a0<\/p>\n
\uf0b7 Propose maintenance contract\u00a0<\/p>\n
\uf0b7 Prepare specification sheet of equipment\u00a0<\/p>\n
\uf09f Process Engineering\u00a0<\/p>\n
\uf09f FOWLP Process Development & Optimization\u00a0<\/p>\n
\uf0b7 Setup demo environment and an office in Arizona\u00a0<\/p>\n
\uf0b7 Develop new businesses by conducting demonstrations\u00a0<\/p>\n
\uf0b7 Develop, qualify, and optimize process, including Temporary\u00a0<\/p>\n
carrier bonding and debonding\u00a0<\/p>\n
\uf0b7 Optimization of process\u00a0<\/p>\n
\uf0b7 Lead DOE, SPC analysis, and yield improvement initiatives\u00a0<\/p>\n
\uf09f Customer & Cross-Functional Technical Support\u00a0<\/p>\n
\uf0b7 Serve as the primary technical interface for process-related topics\u00a0<\/p>\n
\uf0b7 Support customer process integration, NPI, and ramp to HVM\u00a0<\/p>\n
\uf0b7 Collaborate with product, equipment, quality, and R&D teams\u00a0<\/p>\n
\uf0b7 Support customer technical reviews, audits, and escalations\u00a0<\/p>\n
\uf0b7 Others<\/p>\n
\uf0b7 Other general duties are based on projects or particular\u00a0assignments as needed\u00a0<\/p>\n
<\/p>\n
\uf09f Required Qualifications\u00a0<\/p>\n
\uf09f Education\u00a0<\/p>\n
\uf0b7 Bachelor or master degree in:\u00a0<\/p>\n
o Materials Science\u00a0<\/p>\n
o Electrical Engineering\u00a0<\/p>\n
o Chemical Engineering\u00a0<\/p>\n
o Mechanical Engineering<\/p>\n
\uf0b7 Experience\u00a0<\/p>\n
\uf0b7 5\u201310 years of experience in:\u00a0<\/p>\n
o Semiconductor backend process engineering, and\u00a0<\/p>\n
o Advanced packaging or wafer-level packaging environments\u00a0<\/p>\n
\uf0b7 Hands-on experience with FOWLP processes and manufacturing\u00a0<\/p>\n
equipment\u00a0<\/p>\n
\uf09f Technical Skills\u00a0<\/p>\n
\uf0b7 Experience with:\u00a0<\/p>\n
o Backend process of semiconductor\u00a0<\/p>\n
o SPC, DOE, Cp\/Cpk analysis\u00a0<\/p>\n
o Failure analysis and yield modeling\u00a0<\/p>\n
o Cleanroom and HVM environments\u00a0<\/p>\n
\uf0b7 Ability to read and interpret:\u00a0<\/p>\n
o Electrical schematics\u00a0<\/p>\n
o Mechanical drawings\u00a0<\/p>\n
o Pneumatic and vacuum diagrams\u00a0<\/p>\n
<\/p>\n
\uf09f Preferred Qualifications\u00a0<\/p>\n
\uf0b7 Experience supporting backend factories\u00a0<\/p>\n
\uf0b7 Knowledge of PLC\u00a0<\/p>\n
\uf0b7 Familiarity with power devices, AI\/HPC packaging requirements\u00a0<\/p>\n
\uf0b7 Prior field service or customer-facing engineering experience\u00a0<\/p>\n
\uf0b7 Knowledge of slit die coating\u00a0<\/p>\n
\uf09f Soft Skills\u00a0<\/p>\n
\uf0b7 Strong analytical and structured problem-solving skills\u00a0<\/p>\n
\uf0b7 Excellent customer-facing communication abilities\u00a0<\/p>\n
\uf0b7 Ability to work independently at customer sites\u00a0<\/p>\n
\uf0b7 High level of ownership, accountability, and technical credibility\u00a0<\/p>\n
\uf0b7 Ability to communicate in traditional Chinese\u00a0<\/p>\n
\u00a0<\/p>\n
\uf09f Misc.\u00a0<\/p>\n
\uf0b7 This job description is not an employment contract.\u00a0<\/p>\n
\uf0b7 This job description may be revised each year or as business needs\u00a0dictate. Also, the description may be subject to change at\u00a0management's discretion at any time.\u00a0<\/p>\n
\uf0b7 The job description does not constitute any assurance or\u00a0guarantee of employment. The employee\u2019s employment by the\u00a0Company is understood as \u201cEmployment-at-Will.\u00a0<\/p>\n
\uf0b7 Ability to routinely lift, pull, or push objects, up to 50 pounds with\u00a0or without accommodation.<\/p>\n","protected":false},"author":0,"featured_media":0,"template":"","meta":{"_acf_changed":false,"_promoted":"","_job_location":"","_application":"","_company_name":"","_company_website":"","_company_tagline":"","_company_twitter":"","_company_video":"","_filled":0,"_featured":0,"_remote_position":0,"_job_salary":"","_job_salary_currency":"","_job_salary_unit":""},"job-categories":[],"job-types":[],"class_list":["post-24508","job_listing","type-job_listing","status-publish","hentry"],"acf":[],"yoast_head":"\n